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石墨基体上电沉积铜成核机理的研究通过循环伏安法和恒电位阶跃暂态法,研究硫酸铜/硫酸溶液中铜在石墨基体上的电沉积行为,并利用扫描电子显微镜观察石墨基体表面金属铜沉积颗粒的形态和分布。结果表明:在较正的电位区间内,铜的沉积遵从连续成核机理;而在较负的电位区间内,铜的沉积遵从瞬时成核机理。
Study on Copper Nucleation Mechanism of Electrodeposited Copper on Graphite Substrate Electrodepositing behavior of copper on graphite substrate in copper sulfate / sulfuric acid solution was studied by cyclic voltammetry and potentiostatic step transient method. Scanning electron microscopy Morphology and distribution of surface copper deposition particles. The results show that the deposition of copper conforms to the continuous nucleation mechanism in the more positive potential range and the deposition of copper complies with the instantaneous nucleation mechanism in the more negative potential range.