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提出了一种基于塑料散热器无基板板上芯片(COB)封装方式,采用Ansys有限元热分析软件,与传统的陶瓷基板COB封装方式进行热仿真模拟对比分析。研究表明:将LED芯片直接封装在导热系数为20W/(m·K)的塑料散热器上的COB封装方式,得到的LED结温明显低于金属基板的COB封装方式的结温,而与陶瓷基板的COB封装方式接近。进一步模拟分析可知,当塑料散热器的厚度为3.9mm时,器件的总热阻最小,且随着塑料材料的导热系数和塑料散热器表面与空气间对流系数的增加,器件总热阻均有不同程度的减少。由于塑料材料具有容易加工及色泽丰富等优势,这种结构简单的新型封装方式具有广阔的应用前景。
A COB encapsulation method based on plastic heat sink is proposed. By using Ansys finite element thermal analysis software, the thermal simulation is compared with the COB encapsulation method of traditional ceramic substrates. The results show that the LED junction temperature of the LED chip is much lower than the junction temperature of the COB package of the metal substrate when the LED chip is directly encapsulated in a plastic heat sink with a thermal conductivity of 20 W / (m · K) Substrate COB package approach. Further simulation shows that when the thickness of the plastic heat sink is 3.9mm, the total thermal resistance of the device is the smallest. With the thermal conductivity of the plastic material and the convection coefficient between the surface of the plastic heat sink and the air, the total thermal resistance of the device has Different degrees of reduction. Due to its advantages such as easy processing and rich color, the new simple packaging method has broad application prospects.