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研究了退火温度对３种含Ｒｅ量不同的掺杂Ｗ－Ｒｅ丝组织和性能的影响。结果表明：退火温度改变了掺杂Ｗ－Ｒｅ丝的抗拉强度、延伸率、电阻率、弯折性能及晶粒组织。３种含Ｒｅ量不同的掺杂Ｗ－Ｒｅ丝的抗拉强度随退火温度的提高而降低；在相同退火温度下含Ｒｅ量提高，强度越大。当退火温度升至１６００℃时，３种掺杂Ｗ－Ｒｅ丝的延伸率达到最高值，随着退火温度继续升高，延伸率明显下降。Ｗ－Ｒｅ丝电阻率随退火温度提高和Ｒｅ含量增加呈线性增加。掺杂Ｗ加入少量Ｒｅ后，再结晶温度被提高且再结晶温度随Ｒｅ含量增加而降低。掺杂Ｗ－３Ｒｅ丝的再结晶组织形貌与非掺杂Ｗ－３Ｒｅ丝是不同的。非掺杂Ｗ－３Ｒｅ丝的组织形貌类似于纯Ｗ，而掺杂Ｗ－３Ｒｅ丝却保持着掺杂Ｗ丝沿轴向晶粒间互相搭接的长条再结晶晶粒组织
The effects of annealing temperature on the microstructure and properties of three W-Re-doped wires with different amounts of Re were investigated. The results show that the annealing temperature changes the tensile strength, elongation, electrical resistivity, bending properties and grain structure of the W-Re-doped wires. The tensile strength of three kinds of doped W-Re wires with different Re contents decreased with the increase of annealing temperature. With the same annealing temperature, the content of Re increased and the strength increased. When the annealing temperature rose to 1600 ℃, the elongation of the three kinds of doped W-Re wire reached the highest value. With the annealing temperature increasing, the elongation decreased obviously. The resistivity of W-Re increases linearly with the increase of annealing temperature and the increase of Re content. After a small amount of Re is doped with W, the recrystallization temperature is increased and the recrystallization temperature decreases with the increase of Re content. The recrystallized morphology of the doped W-3 Re filaments is different from that of the undoped W-3 Re filaments. The morphology of non-doped W-3Re filaments is similar to that of pure W, while the doped W-3 Re filaments retain the elongated recrystallized grain structure with the W filaments overlapping each other along the axial grains