With the environment temperature varying from 273K to 773K, the dynamic process of void growth in pure aluminium at high strain-rate loading is calculated based on the dynamic growth equation of a void with inteal pressure. The result shows that the effect of temperature on the growth of void should be emphasized. Because the initial pressure of void with gas will increase and the viscosity of materials will decrease with the rising of temperature, the growth of void is accelerated. Furthermore, material inertia restrains the growth of void evidently when the diameter exceeds 10μm. The effect of surface tension is very weak in the whole process of void growth.