近年来,半导体器件和集成电路发展很快,其应用也日益广泛.对其可靠性和稳定性也相应地提出了新的要求.为极大程度地消除由于器件封装漏气使管芯暴露于潮气等各种有害气氛中所导致器件电性能劣化或失效之因素,研究半导体器件和电路封装的气密性,就成为当前和今后不可低估的工作了. In recent years, semiconductor devices and integrated circuits have been developed rapidly and their applications have become more and more widespread, and new requirements have also been put forward for their reliability and stability. In order to largely eliminate the risk of the die being exposed to Moisture and other harmful atmosphere caused by the device performance degradation or failure of the factors that affect the semiconductor devices and circuit packaging airtightness has become the current and future work can not be underestimated.