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使用γ-氨丙基三乙氧基硅烷(KH550)作为偶联剂,对铜粉(Cu)进行了表面化学改性;研究了采用不同偶联剂浓度改性Cu粉时对50%Cu/聚氨酯(PU)复合涂层力学性能、红外发射率、耐腐蚀性能的影响,并对其影响机制进行了分析。结果表明:经过改性后,硅烷偶联剂接枝于Cu粉表面。与未改性样品比较,适当硅烷偶联剂浓度改性的50%Cu/PU涂层在8~14μm波段的红外发射率仍然保持很低(0.1);涂层力学性能有较大的提高,附着力从2级增加到1级,铅笔硬度由4 H增加到6 H,两者均达到最高级;在保持涂层红外发射率不变的前提下,涂层耐碱、酸、盐时间分别从1、50、10 h改善到90、60、50 h;分析认为Cu粉的改性改善了其与聚氨酯界面的相容性及涂层致密性。
The surface chemical modification of Cu powder was carried out by using γ-aminopropyltriethoxysilane (KH550) as coupling agent. The effects of 50% Cu / Polyurethane (PU) composite coating mechanical properties, infrared emissivity, corrosion resistance, and its impact on the mechanism were analyzed. The results show that: after modification, the silane coupling agent grafted to the Cu powder surface. Compared with the unmodified samples, the infrared emissivity of the 50% Cu / PU coating modified by the proper concentration of silane coupling agent remained low (0.1) at the wavelength of 8 ~ 14μm. The mechanical properties of the coating were greatly improved, The adhesion increased from 2 to 1, the pencil hardness increased from 4 H to 6 H, both of which reached the highest level. Under the premise of keeping the infrared emissivity unchanged, From 1,50 and 10 h to 90, 60 and 50 h respectively, it was considered that the modification of Cu powder improved the compatibility with polyurethane and the densification of coating.