,Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system

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A nearly free sustained copper (Cu) film system has been successfully fabricated by thermal evaporation deposition of Cu atoms on silicone oil surfaces,and a characteristic ordered patte has been systematically studied.The ordered patte,namely,band,is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L;its characteristic values of ω and L are very susceptible to the growth period,deposition rate and nominal film thickness.The formation mechanism of the ordered pattes is well explained in terms of the relaxation of the inteal stress in the films,which is related to the nearly zero adhesion of the solid-liquid interface.By using a two-time deposition method,it is confirmed that the ordered pattes really form in the vacuum chamber.
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