论文部分内容阅读
基于提出的光学读出非制冷红外成像系统,先后制作了不同单元尺寸的单层膜无基底焦平面阵列(FPA),获得了室温物体的热图像。分析发现,当FPA的单元尺寸从200μm逐渐减小到60μm时,基于恒温基底模型的理论响应与实验结果的偏差逐渐增大。通过有限元方法,模拟分析了不同尺寸的微梁单元在无基底FPA中的热学行为,发现了当单元尺寸逐渐减小时,恒温基底模型偏差逐渐增大的原因,即无基底FPA的支撑框架逐渐不满足恒温基底条件,受热辐射后,支撑框架的温升从基底上抬高了单元的温升。论文还分析了无基底FPA的红外成像性能。当单元尺寸为60μm时,其热探测灵敏度比传统的有基底FPA高一个数量级。
Based on the proposed optical readout uncooled infrared imaging system, a monolayer-based FPA with different cell sizes was successively fabricated, and a thermal image of the object at room temperature was obtained. The analysis shows that when the unit size of FPA is gradually reduced from 200μm to 60μm, the deviation between the theoretical response and the experimental result based on the constant temperature substrate model gradually increases. The finite element method was used to simulate the thermal behavior of micro-beam units with different sizes in substrate-free FPA. The reason for the gradual increase of temperature model was found when the cell size was gradually reduced. That is, the supporting frame without substrate FPA gradually Does not meet the temperature of the substrate conditions, heat radiation, the support frame temperature rise from the base unit elevation of the temperature rise. The paper also analyzes the performance of infrared imaging without substrate FPA. When the cell size is 60μm, its thermal detection sensitivity is one order of magnitude higher than that of the conventional substrate FPA.