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利用溅镀Sn-Al纳米薄膜和Sn-Cu纳米薄膜讨论结晶机制与膜厚对电磁波屏蔽特性的影响,比较了Sn-Al和Sn-Cu薄膜的高温显微组织、导电性与电磁波屏蔽性能。结果表明,高温处理提高了Sn-Al纳米薄膜的电磁波屏蔽性。在低频条件下,高Cu摩尔浓度的Sn-Cu纳米薄膜不能有效改善电磁波屏蔽性;高温处理后,低Cu摩浓度的Sn-Cu纳米薄膜能提高低频的电磁波屏蔽性,而高频下的电磁波屏蔽性则呈相反趋势。
The influence of the crystal mechanism and film thickness on the electromagnetic shielding properties was discussed by using Sn-Al nano-film and Sn-Cu nano-film. The high temperature microstructure, electrical conductivity and electromagnetic wave shielding performance of Sn-Al and Sn-Cu films were compared. The results show that high temperature treatment improves the electromagnetic shielding of Sn-Al nanostructured films. At low frequency, high Cu molar concentration of Sn-Cu nanofilm can not effectively improve the electromagnetic shielding. After high temperature treatment, low Cu concentration of Sn-Cu nanofilm can improve the low frequency electromagnetic shielding, while the high frequency electromagnetic wave Shielding is the opposite trend.