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合成了一种端环氧基的联苯型液晶(LCEP),采用红外光谱(FT-IR)、示差扫描量热法(DSC)和偏光显微镜(POM)对其结构和热性能进行了分析,并以LCEP、环氧树脂、无机粉体(Al2O3和AlN)制备了环氧塑封料,通过对其力学性能、导热系数、线膨胀系数、电性能及热稳定性的测试研究了LCEP及无机粉体的加入对塑封料性能的影响。结果表明:加入LCEP后,塑封材料的冲击性能、弯曲性能均有所提高。同时,塑封料的导热系数、介电常数、热分解温度随着Al2O3、AlN含量的增加而增大,LCEP对于提高材料的导热性和热稳定性也有一定贡献。而线膨胀系数、介电损耗随着Al2O3和AlN含量的增加而降低,加入LCEP后塑封料的线膨胀系数略有降低。
A kind of epoxy terminated biphenyl liquid crystal (LCEP) was synthesized and its structure and thermal properties were analyzed by infrared spectroscopy (FT-IR), differential scanning calorimetry (DSC) and polarized light microscope (POM) The epoxy molding compound was prepared by LCEP, epoxy resin and inorganic powders (Al2O3 and AlN). The mechanical properties, thermal conductivity, linear expansion coefficient, electrical properties and thermal stability of LCEP and inorganic powders The influence of body adding on the performance of plastic material. The results show that the impact properties and bending properties of the plastic encapsulants are improved after adding LCEP. At the same time, the thermal conductivity, dielectric constant and thermal decomposition temperature of plastic encapsulants increase with the increase of Al2O3 and AlN content. LCEP also contributes to improve the thermal conductivity and thermal stability of the materials. The linear expansion coefficient and dielectric loss decrease with the increase of Al 2 O 3 and AlN contents. The linear expansion coefficient of the molding compounds decreases slightly after adding LCEP.