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提出了一种通过湿法腐蚀实现的基板缺陷共面波导电磁带隙结构,并进行了建模仿真、加工和测试。重点研究了基板缺陷结构与传统金属缺陷结构的差异,以及采用湿法腐蚀工艺的优势。实验结果显示:新结构具有明显的电磁带隙特性;与干法刻蚀工艺相比,采用湿法腐蚀工艺加工可以获得更宽的阻带范围和更强的阻带抑制。该结构完整保留了50Ω共面波导的信号线和接地板金属,可以与传统的金属缺陷结构结合,以获得性能更好的器件。
A substrate defect coplanar waveguide conductive tape gap structure was proposed by wet etching, and the simulation, processing and testing were carried out. The differences between the substrate defect structure and the traditional metal defect structure are mainly studied, and the advantages of the wet etching process are also studied. The experimental results show that the new structure has obvious electromagnetic band gap characteristics. Compared with the dry etching process, the wet etching process can obtain a wider range of stopband and a stronger stopband rejection. This structure completely preserves the 50Ω coplanar waveguide signal line and ground plane metal, which can be combined with the traditional metal defect structure to obtain better performance of the device.