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介绍了航天器上无铅BGA器件的应用,重点介绍了无铅BGA器件的三种工艺焊接方法,通过工艺试验分析得出,三种方法都能较好地解决无铅器件的焊接问题。
The application of lead-free BGA devices on spacecraft is introduced. Three welding methods of lead-free BGA devices are introduced emphatically. Through the process experiment analysis, all three methods can solve the welding problem of lead-free devices.