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This paper aims at developing a stochastic-elastic model of a soft elastic body adhering on a wavy surface via a patch of molecular bonds.The elastic deformation of the system is modeled by using continuum contact mechanics,while the stochastic behavior of adhesive bonds is modeled by using Bell’s type of exponential bond association/dissociation rates.It is found that for sufficiently small adhesion patch size or stress concentration index,the adhesion strength is insensitive to the wavelength but decreases with the amplitude of surface undulation,and that for large adhesion patch size or stress concentration index,there exist optimal values of the surface wavelength and amplitude for maximum adhesion strength.
This paper aims at developing a stochastic-elastic model of a soft elastic body adhering on a wavy surface via a patch of molecular bonds. The elastic deformation of the system is modeled by using continuum contact mechanics, while the stochastic behavior of adhesive bonds is modeled by using Bell’s type of exponential bond association / dissociation rates. It is found that for small particle adhesion patch size or stress concentration index, the adhesion strength is insensitive to the wavelength but decreases with the amplitude of surface undulation, and that for large adhesion patch size or stress concentration index, there exist optimal values of the surface wavelength and amplitude for maximum adhesion strength.