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灌封材料与工艺近十年来发展颇快,环氧类采用低粘度高电性能树脂,如711、616、E—39—D;固化剂采用常温下液态,工艺性好的70、80、HK—021、SYG—8401酸酐;常温固化用593、CHG—333,毒性和放热温度降低较多;增韧性固化利用PAPA、PSPA;填料用电工硅微粉;增韧勒剂用聚硫橡胶,聚醚,液态丁晴、聚氨脂预聚体等;稀释剂用501、269还有增韧性稀样剂HbY。硅橡胶类有机硅凝胶。轻质封装材料用柔嫩扒酯泡沫塑料及泡沫硅橡胶。此外还有聚氨酯弹性体、聚硫橡胶灌封料。工艺设备、检测仪器及操作工艺也均有发展。附应用实例。
Potting materials and processes developed rapidly over the past decade, epoxies using low viscosity and high electrical properties of resins, such as 711,616, E-39-D; curing agent at room temperature liquid, good technology 70,80, HK -021, SYG-8401 anhydride; Room temperature curing with 593, CHG-333, the toxicity and the exothermic temperature decreased more; toughening curing using PAPA, PSPA; filler with electrical silica powder; Ether, liquid Dingqing, polyurethane prepolymer, etc .; thinner 501,269 also toughening dilute sample HbY. Silicone silicone gel. Lightweight packaging materials with soft-peel ester foam and foam silicone rubber. In addition there are polyurethane elastomer, polysulfide rubber potting material. Process equipment, testing equipment and operating processes have also been developed. Attached application examples.