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随着集成电路工业的快速成长,需在短时间内,引进愈小组件设计且导入量产的时间,愈来愈短.为了新产品能尽早导入量产,产品的缺陷的再检查(review)与分类是必要的,以期提供快速缺陷原因分析,改善良率与生产。在传统的做法中,建立新产品的二次电子显微镜的自动缺陷再检查?自动缺陷分类(SEMADR?ADC)最佳化程序,需时至少1个月,以收集足够的二次电子影像数据库,但是,这已经无法符合集成电路工业产品快速转换的需求,提出一种省时间的(模块程序概念)。这概念使不同产品的相似组成?结构层(layer),不需要额外的二次电子显微镜的自动缺陷再检查?自动缺陷分类(SEMADR?ADC)程序建立时间,利用此方法,台湾力晶半导体φ300mm晶圆厂利用0.15μm的缺陷数据库,成功地在2小时内建立新的0.13μm产品线上二次电子显微镜的自动缺陷再检查?自动缺陷分类(SEMADR?ADC)程序,加速缺陷原因分析与良率提升.
With the rapid growth of the integrated circuit industry, it takes less time to introduce smaller component designs and to introduce mass production in a short period of time.In order to introduce new products into mass production as soon as possible, review the product’s defects, And classification is necessary in order to provide a quick analysis of the causes of defects and improve yield and production. In the traditional practice, the automatic defect review of the new electron microscope for secondary electron microscopy (SEMADR® ADC) optimization, which takes at least 1 month to collect enough secondary electron image databases, However, this can no longer meet the demand of rapid conversion of IC industrial products and proposes a time-saving (concept of modular process). This concept enables the similar composition of different products? Structure layer, automatic defect inspection without additional secondary electron microscope? Automatic defect classification (SEMADR? ADC) program to establish time, using this method, Taiwan’s Power Semiconductor Co. φ300mm Using a 0.15μm defect database, the fab succeeded in establishing a new 0.13μm line within 2 hours of automatic defect reexamination on the secondary electron microscope. • Automated Defect Classification (SEMADR® ADC) program to analyze the cause of accelerated defects. Rate increase.