根据统计,IC封测数量持续成长,其中又以覆晶封装和晶圆级封装成长力道最明显,主要系因低成本、高容量和高效能的系统需求。虽然成长趋势不变,但封测业面临的挑战增加,包括平均单价下滑、材料成本高升等。上述趋势带动高效能IC封装技术如带动铜柱、层叠封装和TSV 3D IC等兴起。其中3D IC趋 According to statistics, the number of IC packaging and testing continued to grow, of which the most obvious growth in flip-chip packaging and wafer-level packaging strength, mainly due to low-cost, high-capacity and high-performance system requirements. Although the growth trend remains unchanged, the challenges faced by the IC packaging and testing industry have increased, including the decline in average unit price and the rise in material costs. These trends have driven the emergence of high-performance IC packaging technologies such as copper pillars, stacked packages and TSV 3D ICs. Which 3D IC trend