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1常规的模片粘接及存在问题LG853箱体外形由4层大模片组成,有3层粘接面需要涂胶后再进行模片与模片的粘接,要求涂胶均匀,不断胶、不堆积;粘接后,两模片不错位,无缝隙。常规的工艺是:人工用画笔蘸上胶水再涂敷于模片的粘接面上[1]。存在问题是:①胶水蘸多了,涂敷于粘接面时前段的胶水留下的偏多,胶层偏厚,甚至外溢;②胶水蘸少了,涂敷的胶水偏少,胶层偏薄,产生缝隙,增加蘸胶的总次数;③由于模片
1 Conventional die bonding and problems LG853 box shape by the 4-layer large module, there are 3 layers of adhesive surface need to glue and then die and die bonding, require uniform coating, glue constantly , Do not pile up; Bonding, the two die is not bad bit, no gap. Conventional process is: artificial brush dipped in glue and then applied to the adhesive surface of the die [1]. The problems are: ① glue dipped more, when applied to the bonding surface of the glue left too much, the glue layer is too thick, or even spill; ② glue dipped less, less glue coating, partial glue layer Thin, resulting in cracks, increasing the total number of dip glue; ③ due to the die