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本文概述了双马型聚酰亚胺印制电路基板的研制，探讨了树脂、玻璃布预浸料和印制电路基板的性能，以及可制作成多层印制电路板。实验表明该印制电路板是制造高性能大型计算机用多层印制电路板和耐高温印制电路板的理想基材。
This article outlines the development of double-horse polyimide printed circuit boards, explores the properties of resins, glass cloth prepregs and printed circuit boards, and makes it possible to make multilayer printed circuit boards. Experiments show that the printed circuit board is ideal for manufacturing high-performance large-scale computer multi-layer printed circuit board and high temperature printed circuit board substrate.