论文部分内容阅读
消费者不断要求在越来越小的外形尺寸上实现更多的功能,促使半导体封装专家寻找更薄、更小、更高封装密度的可靠解决方案。而实现此类解决方案部分在于提供制造超小型半导体装置时所使用的材料。这不仅适用于基板的(非导电性)封装,也适用于引线框架(导电性)应用—微型化趋势已扩展到多种封装类型。基板封装的制造商长期以来依靠贴装膜技术来实现小尺寸芯片的封装,以确保胶层的一致性和稳定性,且无芯片倾斜。但在2010年首次推出导电性芯片贴装膜前,除了传统的芯片贴装胶外,引线框架制造商几乎
Consumers continue to demand more functionality in smaller and smaller form factors, prompting semiconductor package experts to find reliable solutions for thinner, smaller, and higher package densities. Part of the solution to this type of solution is to provide the materials used to make ultra-small semiconductor devices. This applies not only to the (non-conductive) package of the substrate but also to the lead frame (conductive) applications - the trend of miniaturization has been extended to a wide range of package types. Manufacturers of substrate packaging have long relied on mounting film technology to achieve small-chip packaging to ensure consistency and stability of the layers without chip tilt. However, before the introduction of the conductive chip mounting film for the first time in 2010, in addition to the traditional chip mounting adhesive, the lead frame manufacturer almost