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一、前言 主半导体器件制造中,广泛采用表面钝化来改善器件的可靠性。常用的钝化材料有SiO_2、磷—硅玻璃、Si_3N_4和Al_2O_3等。
I. INTRODUCTION In the manufacture of main semiconductor devices, the surface passivation is widely used to improve the reliability of the device. Common passivation materials are SiO_2, phosphorus - silica glass, Si_3N_4 and Al_2O_3 and so on.