据报道,日本富士通公司开发出了新型倒装芯片封装技术。该技术可形成35微米超细间距的焊点和高精度的倒装芯片互连。与传统倒装芯片互连相比,该项技术突破性将连接密度提高了大约50倍。传统的倒装芯片技术为了避免焊点间的短路,焊点间距大约介于 It is reported that Fujitsu Japan has developed a new type of flip-chip packaging technology. The technology creates ultra-fine pitch solder joints of 35 microns and high-precision flip-chip interconnects. Compared with traditional flip-chip interconnects, this technology breakthrough connection density increased by about 50 times. Traditional flip-chip technology in order to avoid short-circuit between the solder joints, pad spacing about