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环氧导电胶是代替Sn/Pb焊料的一种胶黏剂,与传统的Sn/Pb焊料相比,环氧导电胶具有粘接温度低、可控性好、分辨率高、工艺简便以及环保等优点。近年来,科研工作者积极地研发高性能、多功能以及低成本的新型导电胶,以满足不断发展的市场需求。环氧导电胶作为一种新型的复合工业材料,具有巨大的发展潜力以及广阔的应用前景。阐述了影响环氧导电胶黏剂性能的因素以及高性能环氧导电胶的研究状况,并对环氧导电胶黏剂的未来发展作了展望。
Epoxy conductive adhesive is a kind of adhesive instead of Sn / Pb solder. Compared with the traditional Sn / Pb solder, the epoxy conductive adhesive has the advantages of low bonding temperature, good controllability, high resolution, simple process and environmental protection Etc. In recent years, researchers actively develop new conductive adhesives with high performance, versatility and low cost to meet the evolving market demand. Epoxy conductive adhesive as a new type of composite industrial materials, with great potential for development and broad application prospects. The factors influencing the performance of epoxy conductive adhesive and the research status of high performance epoxy conductive adhesive are expounded. The future development of epoxy conductive adhesive is also forecasted.