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流镀是在电刷镀基础上发展起来的一种新的快速电镀技术。流镀的工艺原理是:镀液以高速流过阳极与工件(阴极)之间的窄小间隙或直接喷射于工件表面,在强大的电场力作用下实现快速沉积。 同传统的槽镀相比,流镀具有下列优点: (1)电流密度大,一般为槽镀的几到几十倍,因而沉积速度快。 (2)镀液可循环流动使用,不需要庞大的镀槽,废液少,设备占地面积小。 (3)可实现局部沉积,因而应用于机械零件修
Flow plating is a new rapid plating technique developed on the basis of brush plating. Flow plating process principle is: high-speed flow of the bath through the anode and the workpiece (cathode) between the narrow gap or directly sprayed on the workpiece surface, in the strong electric field force to achieve rapid deposition. Compared with the traditional slot plating, flow plating has the following advantages: (1) current density, usually a few to several times the slot plating, and thus deposition speed. (2) bath can be used circulating fluid, does not require a large plating tank, less waste, equipment, small footprint. (3) can be localized deposition, which applied to mechanical parts repair