电子回旋共振波(ECWR)技术于20世纪70年代提出,是利用电磁波与电学各向异性材料(如带有外加静磁场的低压等离子体)的相互作用来产生等离子体的。ECWR技术有产生高密度等离子体、离子能量可控制在很窄的范围内、离子能量和离子流量可独立控制等优点,可有效控制薄膜的生长过程。本文以ECWR技术为背景,介绍了一种电子回旋共振波射频溅射镀膜系统的设计。 Electron cyclotron resonance (ECWR) technology was introduced in the 1970s to generate plasma using the interaction of electromagnetic waves with electrically anisotropic materials such as low pressure plasmas with an applied static magnetic field. ECWR technology produces high-density plasma, ion energy can be controlled in a very narrow range, ion energy and ion flux can be controlled independently, etc., which can effectively control the film growth process. In this paper, ECWR technology as a background, introduced a electron cyclotron resonance RF sputtering coating system design.