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铜引线键合由于低廉的成本和优良的材料综合性能而受到越来越多的重视,而镀钯铜线较纯铜线的应用更为广泛。其中,自由空气球(FAB)上钯的覆盖情况是需要进行研究的问题之一。由于烧球工艺为瞬态过程,因此在形成FAB后其表面的钯可能会出现不均匀的分布,后续的塑封环节中低含量的钯区域就会遭受外界的侵蚀,这对焊点的可靠性会有不良的影响。基于此,针对线径20μm镀钯铜线FAB上的钯覆盖区域进行了探究,并采用定制化的化学腐蚀方案来显示FAB上钯膜较厚区域和较薄区域在形貌上的差异。此外还讨论了不同电子火焰熄灭(EFO)工艺参数样品的钯薄弱区形状参数,最后分析了影响FAB表面上钯薄弱区的主要工艺因素,得到了相关工艺参数参考值,对后续工艺的可靠性提升有一定的借鉴意义。
Copper wire bonding due to the low cost and excellent overall performance of materials by more and more attention, and the application of pure copper wire than palladium copper is more widely used. Among them, the free-air ball (FAB) on the palladium coverage is one of the issues that need to be studied. Due to the process of burning the ball as a transient process, the palladium on the surface of the FAB may be unevenly distributed after forming the FAB, and the low content of palladium in the subsequent plastic part will be eroded by the outside world, and the reliability of the solder joint There will be adverse effects. Based on this, the palladium coverage on the FAB copper wire with a diameter of 20 μm was investigated and the morphology of the palladium film on the FAB was compared with the patterned chemical etching scheme. In addition, we also discussed the shape parameters of the weak zone of palladium in the samples of different electronic flame extinguishing (EFO) process parameters. Finally, we analyzed the main process factors that affect the weak zone of palladium on the FAB surface, obtained the reference values of the relevant process parameters, Enhance the use of a certain significance.