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通过试验和数值模拟两种方法分析细间距器件SnAgCu焊点的热疲劳寿命。采用-55~125℃温度循环试验,发现SnAgCu焊点疲劳寿命约为1150次。基于Anand方程和Wong方程两种本构模型,针对两类疲劳寿命预测方程进行对比研究。结果显示,基于两种模型计算的SnAgCu焊点应力时间历程曲线具有相类似的趋势,但是应力值有较大差别。针对两类疲劳寿命预测方程,结合试验研究分析焊点的疲劳寿命,基于Wong方程结合双蠕变模型计算的疲劳寿命值和试验结果吻合良好,而基于Anand方程结合Engelmaier修正的Coffin-Mason方程计算的疲劳寿命略高于试验结果。
The thermal fatigue life of SnAgCu solder joints with fine pitch devices was analyzed by experiment and numerical simulation. Using -55 ~ 125 ℃ temperature cycling test found that the fatigue life of SnAgCu solder joints is about 1150 times. Based on two constitutive models of Anand equation and Wong equation, two types of fatigue life prediction equations are compared. The results show that the stress-time curves of SnAgCu solder joints based on the two models have a similar trend, but the stress values are quite different. According to the two types of fatigue life prediction equations, the fatigue life of the solder joint is analyzed with the experimental study. The fatigue life based on the Wong equation and the dual creep model agree well with the experimental results. The Coffin-Mason equation based on the Anand equation and the Engelmaier correction The fatigue life is slightly higher than the test results.