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A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area,this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure,the chillers’ water-pressure requirement is reduced.Meanwhile,the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low,it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.
A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks. Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software. effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers’ water-pressure requirement is reduced.Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime. This heat-sink is an ideal choice for the package of high power density laser diode array stacks.