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关于ICEPT-HDP2008在过去十多年间,由中国电子学会生产技术学分会(CEPS)主办的电子封装技术(ICEPT)和上海大学主办的高密度封装(HDP)两个国际会议为来自海内外学术界和工业界的专
About ICEPT-HDP2008 In the past ten years, two international conferences, Electronics Packaging Technology (ICEPT) sponsored by CEPS and High-Density Packaging (HDP) sponsored by Shanghai University, have attracted attendees from academia both at home and abroad And industry professionals