前言 半导体集成电路(IC)技术的出现,至今已有20多年的历史了。在这二十年期间,一方面通过提高集成度寻求高性能化,使集成电路技术由中规模(MSI),大规模(LSI)进一步发展为超大规模集成(VLSI)化。其中,电子技术革新一直起着主导作用。另一方面,作为其辅助技术的印刷布线板业已成为电子技术发展的一部分。早在集成电路出现以前,人们就用通孔铜镀法制作了双面和多层印制板。 Foreword The emergence of semiconductor integrated circuit (IC) technology, has been more than 20 years of history. During these two decades, on the one hand, the pursuit of high performance through the enhancement of integration has led to the further development of integrated circuit technology from medium-scale (MSI) and large-scale (LSI) to very large-scale integration (VLSI). Among them, electronic technology innovation has always played a leading role. On the other hand, printed wiring boards as ancillary technologies have become part of the development of electronic technology. Long before the advent of integrated circuits, people used double-sided and multi-layer printed circuit boards with through-hole copper plating.