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一、前言氧化铜磷酸盐无机粘接剂是分别以经高温处理的氧化铜和浓缩磷酸溶液为主要成分的双组份无机胶。粘接剂用的氧化铜,一般都是用可溶性铜盐和碱反应,制得沉淀氧化铜。因为沉淀氧化铜与浓缩磷酸反应比较激烈,在调胶过程中很快就会固化,涂胶操作困难而无法使用。为此,沉淀氧化铜必须经过高温处理,一般在920℃左右灼烧,过200目筛。这种特制氧化铜与浓缩磷酸溶液反应
I. Introduction Copper oxide phosphate inorganic binder is respectively treated with high temperature copper oxide and concentrated phosphoric acid solution as the main component of two-component inorganic glue. Copper oxide used in adhesives, are generally soluble copper salt and alkali reaction, the precipitation of copper oxide. Because the precipitation of copper oxide and concentrated phosphoric acid reaction is more intense, quickly adjust the glue curing process, coating operation difficult and can not be used. To this end, precipitation of copper oxide must be high temperature treatment, usually about 920 ℃ burning, over 200 mesh sieve. This special copper oxide and concentrated phosphoric acid solution reaction