Effect of thermophysical property and coating thickness on microstructure and characteristics of a c

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A 新改善扔技术(IC ) 的投资被介绍了并且与存在 IC 技术例如相比输扔的泡沫(LFC ) 。thermophysical 性质和涂层的效果厚度上扔的团结温度地,微观结构和坚硬被调查了。结果证明团结与涂层相反地评估减少厚度涂层什么时候包含硅石大音阶的第五音,锆石粉末,多铝红柱石粉末和消去的代理人。相反,作为涂层厚度使率增加凉下来的固体增加。不管多么,团结率并且扔的冷却的率生产了由的固体存在 IC 和改进 IC 是很类似的涂层厚度什么时候是 5 公里,改进 IC 和存在 IC 生产的容器角落试穿的微观结
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