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采用Cu-22%Zn中间层,在510℃、真空度为0.01 Pa和不同连接时间下将两种异质合金Al 2024和Ti-6Al-4V进行瞬时液相连接。采用SEM、EDS和XRD技术对连接区的显微组织演变进行表征。结果表明,接头的形成归因于Cu和Zn固相扩散进入Ti-6Al-4V和Al2024合金中,然后形成共晶并沿Cu-Zn/Al 2024界面等温扩散。接头界面处的硬度随连接时间的延长而增加,这是由于形成了Al_2Cu、TiCu3、Al_(4.2)Cu_(3.2)Zn(0.7)、Al_(0.71)Zn_(0.29)、Ti_2Cu、TiAl_3和TiZn_(16)金属间合物。此外,当连接时间为60 min时,接头的剪切强度达到最大,为37 MPa。
Two heterogeneous alloys, Al 2024 and Ti-6Al-4V, were transiently liquid-phase connected using a Cu-22% Zn interlayer at 510 ° C with a vacuum of 0.01 Pa and different bonding times. SEM, EDS and XRD techniques were used to characterize the microstructure evolution of the junction zone. The results show that the formation of the linker is due to the solid phase diffusion of Cu and Zn into the Ti-6Al-4V and Al2024 alloys, followed by eutectic formation and isothermal diffusion along the Cu-Zn / Al 2024 interface. The hardness at the joint interface increases with the extension of the connection time due to the formation of Al 2 Cu, TiCu 3, Al 4.2 Cu 3.2 Zn 0. 0.7 Al 0.71 Zn 0.29 Ti 2 Cu, TiAl 3 and TiZn_ ( 16) Metallic Intermetallics. In addition, when the connection time is 60 min, the joint shear strength reaches the maximum, 37 MPa.