日本村田制造厂过去一直使用银糊作电视机电子调谐器的混合集成电路导体。1981年9月首先使用铜代替银糊。过去混合集成电路的电极使用银—钯合金,每块调谐器的基板(6×5厘米)使用0.1—0.2克银。采用铜可大幅度地降低其成本。代替银糊的代用品其氧化速度快並由于气压变化和湿度的影响会出现短路现象,因此不适用。该厂所研制的铜糊是把铜 Murata Manufacturing Co., Ltd. of Japan used to use silver paste as a hybrid electronic circuit tuner integrated circuit conductor. September 1981 first use of copper instead of silver paste. In the past, the electrodes of the hybrid integrated circuits used silver-palladium alloy, and 0.1-0.2 g silver was used for each tuner substrate (6 x 5 cm). The use of copper can significantly reduce its cost. Substitutes for silver instead of silver oxide oxidation fast and due to pressure changes and humidity effects of short-circuit phenomenon, it does not apply. The copper paste developed by the factory is copper