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从理论和实验上深入研究了反应直流磁控溅射放电的电流-电压特性。指出,利用此特性可以判别反应直流磁控溅射过程中靶面状态的变化,从而达到稳定成膜工艺的目的。最后根据结果给出了几点实验结论。
The current-voltage characteristics of reactive DC magnetron sputtering are deeply studied theoretically and experimentally. It is pointed out that this characteristic can be used to discriminate the change of the target state during the reactive DC magnetron sputtering process and thus achieve the purpose of stabilizing the film forming process. Finally, according to the results, some experimental conclusions are given.