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借助金相显微镜和EBSD技术观察了紧凑式带钢(CSP)工艺生产的热轧Hi-B钢板的显微组织和晶粒取向分布情况,分析了晶粒取向的演变过程。结果表明:与传统厚板坯工艺生产的Hi-B钢相比,CSP工艺生产的Hi-B钢热轧组织更加细小均匀,在压下量不足的情况下可以在热轧板表层产生少量较为严格的取向Goss晶粒;CSP工艺生产的Hi-B钢热轧板织构强度比用传统厚板坯生产的热轧板织构强度高,表层以{110}面织构为主,同时含有少量Goss织构、黄铜织构和铜型织构等。较高取向度的Goss晶粒与黄铜晶粒和铜型晶粒相邻。中心层主要为轧制变形晶粒,织构组分聚集在α取向线上,其中{112}<110>织构组分强度最高。
The microstructure and grain orientation distribution of hot-rolled Hi-B steel produced by compact strip (CSP) process were observed by metallographic microscope and EBSD technique. The evolution of grain orientation was analyzed. The results show that compared with Hi-B steel produced by traditional thick slab process, the hot-rolled microstructure of Hi-B steel produced by CSP process is more fine and uniform. When the reduction is insufficient, a small amount of hot- Strict orientation of the Goss grains; CSP process Hi-B steel hot-rolled plate texture than the traditional thick slab hot-rolled plate with high texture, the surface {110} texture of the main structure, while containing A small amount of Goss texture, brass texture and copper texture and so on. Goss grains of higher orientation are adjacent to brass grains and copper grains. The central layer is mainly composed of rolling deformation grains, and the texture components are aggregated on the α-oriented lines. The {112} <110> texture component has the highest intensity.