就加工技术而言,有硅的微细机械加工技术,利用X射线的LIGA工艺技术,切削等传统的机械加工技术,放电加工,立体刻蚀,利用光束的加工技术,光造形法等.在众多的加工技术中,绝大多数利用硅的微细机械加工技术.硅加工技术有10年的历史,它可分为表面微机械加工和主体微机械加工两种,并且在传感器领域正得到许多应用. In terms of processing technology, there are silicon micro-machining technology, the use of X-ray LIGA technology, cutting and other traditional machining technology, electrical discharge machining, three-dimensional etching, the use of light beam processing technology, Of the processing technology, the vast majority of the use of silicon micro-machining technology. Silicon processing technology has 10 years of history, it can be divided into surface micro-machining and micro-machining of the main two, and in the field of sensors are many applications.