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三维集成的技术优势正在延伸到大量销售的诸如消费类电子设备潜在应用的产品领域。这些新技术也在推进着当前许多生产工艺的包封能力,其中包括光刻工艺和晶圆键合。> 还需要涂胶,形成图形和刻蚀图形结构。研究了一些用于三维封装的光刻和晶圆键合技术问题并将叙述全部的挑战和适用的解决方案。技术方面的处理结果将通过晶圆键合和光刻工序一起讨论。
The technical advantages of 3D integration are extending into the mass-market product areas for potential applications such as consumer electronic devices. These new technologies are also driving the encapsulation capabilities of many current production processes, including lithography and wafer bonding. > You also need to glue, form graphics and etch graphics structures. Some of the photolithographic and wafer bonding technologies used for 3D packaging have been studied and all the challenges and applicable solutions will be described. Technical aspects of the processing results will be wafer bonding and lithography process together.