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采用热压法制备了不同TiB_2粒度增强的Ag-4%TiB_2(质里分数)触头材料,研升了TiB_2粒度大小对Ag-4%TiB2触头材料组织及性能的影响。利用扫描电子显微镜和激光共聚焦显微镜对Ag-4%TiB_2触头材料的组织和电弧侵蚀后的形貌进行了表征,对致密度、硬度及导电率进行了测量。结果表明:热压法有助于提高Ag-4%TiB_2触头材料的致密度。随着TiB_2粒径的减小,硬度先增大后减小,导电率不断增大。细小弥散分布的TiB_2颗粒有助于改善耐电弧侵蚀性,侵蚀面积较大,蚀坑浅,燃弧时间短。
The effects of TiB 2 grain size on the microstructure and properties of Ag-4% TiB2 contact materials were investigated by hot pressing method. The microstructure of the Ag-4% TiB 2 contact material and the morphology after arc erosion were characterized by scanning electron microscopy and confocal laser scanning microscopy. The density, hardness and electrical conductivity of the Ag-4% TiB 2 contact material were characterized. The results show that hot pressing can improve the density of Ag-4% TiB_2 contact materials. With the decrease of TiB_2 particle size, the hardness first increases and then decreases, and the conductivity increases. Finely dispersed TiB 2 particles help to improve arc erosion resistance, erosion area larger, shallow pits, arcing time is short.