Akustica 可能听起来像一个新的重金属乐队,但实际上它是位于匹兹堡的 Carnegie Mellon 公司的一个分公司,是不断增长的无晶圆厂芯片公司中的一员。这些公司正借助 CMOS 代工厂现有的基础设施生产功能与 CMOS 关系不大的芯片。Akustica 公司采用 CMOS 工序中的第1层金属来制造扩音器的网孔。Akustica 的首席执行官与创建者 Ken Gabriel 在 SEMICONWest 的一次技术论坛上谈论新产品时说“我们所做的是想出如何采用标准的 CMOS(即由所有的代工厂提供的传统的 CMOS),以及通过一系列自主开发的后 CMOS 蚀刻步骤将这种 CMOS 转变成 CMOS MEMS 芯片。”另一个最近的例子是 Luxtera 公司,这家公司主要生产 Akustica may sound like a new heavy metal band, but in fact it is a division of Carnegie Mellon in Pittsburgh and a growing fabless chip company. These companies are relying on CMOS foundries existing infrastructure to produce CMOS chips that have little to do with CMOS. Akustica uses the first layer of metal in the CMOS process to create megaphone holes. Ken Gabriel, Akustica’s chief executive officer and founder, talked about new products at a SEMICONWest technology forum. “What we did was figure out how to use standard CMOS (a traditional CMOS provided by all foundries) And converting this CMOS into a CMOS MEMS chip through a series of self-developed post-CMOS etch steps. ”" Another recent example is Luxtera, which produces mainly semiconductors