一、半导体封装的种类半导体和集成电路的封装,主要分为两类:1.泄漏率符合美国MIL标准(≤1×10~(-10)厘米~3/秒)的、以金属和玻璃的熔融粘结体与多层烧结陶瓷为主体的、具有高度气密性的气密封装;2.因半导体表面技术(钝化)的发展而产生的、既经济又可大批投产的、采用树 First, the type of semiconductor packaging Semiconductor and integrated circuit packaging, are mainly divided into two categories: 1. Leakage rate in line with the United States MIL standards (≤ 1 × 10 ~ (-10) cm ~ 3 / s) to metal and glass Melt bonded body and multi-layer sintered ceramic as the main body, with airtight hermetic packaging; 2 due to the development of semiconductor surface technology (passivation) generated, both economical and mass production, the use of trees