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本文阐述了电子封装铝基复合材料的制备过程。测试出铝基复合材料线膨胀系数。发现经不同冷却处理或者测试不同的方向，其线膨胀都不一样，根据残余应力和择优取向理论解释了这种现象。
This article describes the preparation of electronic packaging aluminum matrix composites. Test aluminum composite linear expansion coefficient. It is found that the linear expansion is different for different cooling treatments or tests of different directions, and this phenomenon is explained according to residual stress and preferred orientation theory.