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采用电子背散射衍射(EBSD)技术,着重研究了固溶温度对新型耐热合金晶界特性的影响。结果表明:该新型合金在1125~1200℃固溶处理时,随固溶温度升高至1200℃,晶界数量和长度降低,平均晶粒尺寸增加至约205μm;同时,随固溶温度升高,合金中的大角度晶界频率降低,小角度晶界频率提高,且大角度晶界中重位点阵晶界频率降低。
The effect of solution temperature on the grain boundary properties of new heat resistant alloys was studied by using electron backscatter diffraction (EBSD) technique. The results show that with the increase of solution temperature from 1200 ℃ to 1200 ℃, the grain size and length of the new alloy decrease with the increase of solution temperature from 1125 ℃ to 1200 ℃. The average grain size increases to about 205μm. At the same time, , The frequency of high-angle grain boundaries decreases and the frequency of small-angle boundaries increases, and the frequency of the heavy lattice boundaries in the large-angle grain boundaries decreases.