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随着电子设备不断向小型化、集成化发展,热电制冷技术作为一种有效的主动冷却方法被广泛用于重要部件的温度控制。为了获得最佳的制冷效果,文中针对散热受限条件下的CCD芯片热电制冷系统非稳态过程,建立了一个数值分析模型。分析结果表明:在散热受限时,热电制冷系统的传热过程长时间处于非稳态过程;在不超过最大制冷电流的条件下,增大制冷电流可以提高制冷效果,但是大的制冷电流可能出现温度回升的现象;虽然热端散热能力的提高可以改善制冷效果,但是存在一个极限值,这与热电制冷器(TEC)的优值系数有关;当系统载荷发生变化时,合理改变制冷电流和热端散热能力可以提高系统的温度稳定性,其中制冷电流对系统温度稳定性的影响更大。
As electronic devices continue to be miniaturized and integrated, thermoelectric cooling technology is widely used as an important active cooling method for temperature control of important components. In order to obtain the best cooling effect, a numerical analysis model is established for the non-steady-state process of thermoelectric cooling system of CCD chip under the condition of heat dissipation. The results show that the heat transfer process of the thermoelectric cooling system is unsteady for a long time when the heat dissipation is limited. Increasing the cooling current can increase the cooling effect under the condition of not exceeding the maximum cooling current. However, the large cooling current may The phenomenon of temperature rise appears. Although the increase of cooling capacity at the hot end can improve the cooling effect, there is a limit value related to the merit coefficient of the thermoelectric cooler (TEC). When the system load changes, the cooling current and Hot-end cooling capability can improve the system’s temperature stability, of which the cooling current on the system temperature stability greater impact.