我们试验室最近进行一系列紫铜工艺试验,制作晶粒度金相评级图,因此有较多的紫铜试样须作金相分析。以往我们对软质的紫铜及铜合金都是采用机械抛光,一个试样往往须反复进行多次机械抛光,不仅花费时间长,效果还不理想;尤其对未退火冷拔紫铜原材料和大晶粒试样效果更差。为了解决这一问题,决定采用化学抛光法进行试验。 Our laboratory recently conducted a series of copper technology test, the grading metallographic grading map, so there are more copper samples for metallographic analysis. In the past we are on the soft copper and copper alloys are used mechanical polishing, a sample often have to be repeated multiple mechanical polishing, not only takes a long time, the effect is not ideal; especially for unannealed copper raw materials and large grains The sample is even worse. In order to solve this problem, decided to use chemical polishing test.