模塑电路板(MCB-Molded Circuit Board)把业界带上引人入胜的技术旅行,即使这段旅行没有留下什么痛苦的教训,但最好也要把它忘记。正如许多“先进的”PGB 技术一样,人们想出了3-D 模塑电路并在这场‘模塑电路革命"之前制造了几十年。1950年,Kliever 为 PCB 提出一个称为模塑电阻器件的专利。其他人也玩弄了3-D 电路的逻辑概念。1957年,ITT 公司的Burdett 为多平面电路提出一个专利,在这种电 MCB-Molded Circuit Board Bring the industry with compelling technological travel, and even if this trip left no painful lessons, it is best to forget it. Like many advanced PGB technologies, people came up with 3-D molded circuits and made them decades before this ’mold circuit revolution.’ In 1950 Kliever proposed a PCB A patent for molded resistor devices.Other people also played the logical concept of 3-D circuits.In 1957, ITT’s Burdett proposed a patent for multi-planar circuits,