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采用化学合成方法,利用甲苯-2,4-二异氰酸酯、羟基硅油和二乙胺合成了新型的环氧树脂含硅固化剂,使用红外光谱分析初步确定了合成固化剂的分子结构,通过差示扫描量热法(DSC)分析了合成固化剂/环氧树脂固化体系的固化动力学,并对固化制度进行了优化计算。采用分析固化动力学常用的Kissinger等分析方法,对体系表观活化能和反应级数进行了分析。计算结果表明,体系的表观固化活化能为57.07kJ/mol,反应级数为n=0.920 3。外推法得到体系理论凝胶温度Tgel=366.51K、最大固化速率温度Tcure=386.44K、后固化温度Ttreat=397.30K。
A new type of epoxy resin containing silicon curing agent was synthesized by chemical synthesis method using toluene-2,4-diisocyanate, hydroxy silicone oil and diethylamine. The molecular structure of the synthesized curing agent was initially determined by infrared spectroscopy. The curing kinetics of the synthetic curing agent / epoxy resin curing system was analyzed by scanning calorimetry (DSC). The curing system was optimized. The apparent activation energy and reaction order of the system were analyzed by Kissinger and other analytical methods commonly used in the analysis of curing kinetics. The calculated results show that the apparent curing activation energy of the system is 57.07 kJ / mol and the reaction order is n = 0.920 3. Extrapolation method system theory gel temperature Tgel = 366.51K, the maximum cure rate temperature Tcure = 386.44K, after curing temperature Ttreat = 397.30K.