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对高导三元铜合金在热处理时的工艺与形变之间的关系进行研究。结果表明,优化后的工艺为铸锭在1 204 K的温度下进行均匀退火60 min,将其在1 245 K的温度下进行固溶处理60 min,随后将其快淬至常温后进行应变为65%的冷变形处理,在784K的温度下进行时效处理70 min。经过这一处理后所得试样具有较好的力学性能,电导率可达到87%IACS,显微硬度可高达189 HV。未经冷变形处理所得试样的导电率约为82%IACS,显微硬度约为140 HV。经比较可知,当试样在时效处理前进行25%~85%的应变冷变形时,可使其显微硬度提高25 HV以上。
The relationship between the process and deformation of high conductivity ternary copper alloy during heat treatment was studied. The results show that the optimized process is that the ingot is uniformly annealed at a temperature of 1 204 K for 60 min, and the solution is solution treated at a temperature of 1 245 K for 60 min, then quenched to room temperature, 65% cold deformation treatment, aging treatment at a temperature of 784K 70 min. After this treatment, the resulting sample has good mechanical properties, electrical conductivity can reach 87% IACS, microhardness up to 189 HV. The resulting samples without cold deformation had a conductivity of about 82% IACS and a microhardness of about 140 HV. It can be seen from the comparison that when the sample is cold-deformed from 25% to 85% before aging treatment, the micro-hardness can be increased more than 25 HV.