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TI开发R FID包装箱一体化签条成功R FID标签生产商德州仪器T I穴T exas Instrum ents雪与一家位于芝加哥的纸板和包装产品制造商,共同开发了一种将R FID标签应用在包装箱上的包装模式——“R FID包装箱一体化签条”。这种模式是将一个R FID标签嵌体穴Inlay雪直接集成到波纹纸板
TI Develops R FID Container Integration Signature Success R FID Label Manufacturer Texas Instruments TI Exas Instrum ents Snow and a Chicago-based manufacturer of cardboard and packaging products have jointly developed a RFID tag application in the box On the packaging mode - “R FID box integration tag.” This mode incorporates an R FID tag inlay snow inlay directly into the corrugated cardboard