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扁平封装集成电路器件结构是由衬底和盖以胶粘结之,芯片装于衬底上,如图一所示。由于结到衬底的热阻比结到盖的热阻小,那么是正装的结温高,还是反装的结温高?加散热片后效果又如何?所谓正装就是衬底贴印制电路板、盖朝上,反装就是盖贴印制电路板、衬底朝上。模拟实验(用玻璃布胶板代替印制电路板,组件引线未焊接到板上,用502胶将组件粘于玻璃布胶板上)结果表明:正、反装热阻没有明显的差别,加散热片后热阻降低,而反装加散热片效果更好,即热阻(结温)大幅度下降。实验结果是否可靠?我认为
Flat package integrated circuit device structure is the substrate and the lid with adhesive bonding, the chip mounted on the substrate, as shown in Figure 1. Since the junction to the substrate thermal resistance than the junction to cover the thermal resistance is small, then is installed the junction temperature is high, or anti-installed junction temperature is high? What is the effect after adding heat sink? So-called is the substrate mounted printed circuit Board, cover up, the reverse is printed on the printed circuit board, the substrate up. Simulation experiments (glass cloth board instead of printed circuit board, component leads are not soldered to the board, with 502 glue to glue the components on the glass cloth board) The results show that: positive and negative thermal resistance no significant difference, plus Thermal resistance after the heat sink to reduce, and anti-mounted heat sink better, that is, thermal resistance (junction temperature) dropped significantly. Is the experimental result reliable? I think