采用扫描电镜对镀锡基板表面线状缺陷进行了分析,结果发现,造成镀锡基板表面缺陷的主要原因为保护渣卷入和氧化铁皮残留。通过对镀锡基板生产工艺进行分析,得出:控制连铸过程铝损不大于0.005 0%、液面波动控制在±2.5mm、控制板坯入炉温度不小于200℃,合理控制连浇炉数,增大拉矫破鳞机弯辊插入深度,可以大幅减少镀锡基板表面线状缺陷的产生。 Scanning electron microscopy (SEM) was used to analyze the linear defects on the surface of tin-plated substrate. The results showed that the main reason for the surface defects of tin-plated substrate was entrapment of flux and residual of scale. Through the analysis of the production process of tinplate substrate, it is concluded that the aluminum loss in the control continuous casting process is not more than 0.005%, the liquid level fluctuation is controlled at ± 2.5mm, the slab temperature is not less than 200 ℃, Number, increase the straightening scale bending machine bending depth, can significantly reduce the tin-plated substrate surface linear defects.